Fig.1 Solder balling/beading Solder beading Solder beading is big solder ball, it occurs when isolated solder paste aggregates are formed under low stand-off components. At reflow, the aggregate ...

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

The Ball Grid Array (BGA ... Recently he ran a test batch to show off his soldering process and illustrate one of the errors a novice might make. For those that are unfamiliar, the BGA footprint ...

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...