Most of us will probably have seen semiconductor wafers as they trundle their way through a chip factory, and some of us may have wondered about why they are round. This roundness is an obvious ...

ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with square substrates, which promises to increase the company's advanced ...

Most of us will probably have seen semiconductor wafers as they trundle their way through a chip factory, and some of us may have wondered about why they are round. This roundness is an obvious ...

These panels offer a usable area approximately 3.7x larger than traditional 300-mm round wafers, allowing more chips to be produced per wafer and reducing waste at the edges. However, the new ...

The chipmaker reportedly plans to switch from conventional round wafers to rectangular substrates, allowing significantly more chips to be placed on each wafer. The proposed rectangular substrate ...

The new approach would use rectangular panel-like substrates, compared to the conventional round wafers of today. This new method is called panel-level packaging, which would allow more chips to ...

TSMC (Taiwan semiconductor) has a major multi-year plan to create rectangular substrate (510 millimeters by 515 millimeters) with over triple the usable area of current round wafers. The rectangular ...

In 2025, that figure is expected to surge to roughly 80,000 wafers. Beyond ramping up production, the chipmaker reportedly plans to switch from conventional round wafers to rectangular substrates ...

The price of G12R and G10L wafers has seen a price increase from the previous week. Source: Silicon Industry Branch. A round-up of news from China with the price of solar wafers going up ...

GlobalWafers is set to receive $406 million in direct funding from the US government's CHIPS act to support the construction of two fabs, the newly opened facility in Sherman, Texas, and a second in ...

Unlike traditional round wafers, ACM’s innovative design ensures a precise bevel removal process that remains confined to the bevel region, even on warped panels. This advancement is vital for ...