The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

But the test wafers suggest that Intel is on pace, or maybe even a bit ahead of schedule, for producing 1.8nm-class chips in the middle of this year. If Intel can prove wrong the rumors about it ...

TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according to ijiwei and Commercial Times, ...

Another interesting trend according to Fischer is the increased market share of rectangular wafers both in the 182mm size (M10R) and 210 mm size (G12R). “This is interesting to see, especially ...

TL;DR: Intel announced Lip-Bu Tan as CEO and achieved a milestone by testing its 18A process node wafers at its Arizona fab, marking a significant step for U.S. semiconductor manufacturing.

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It remains uncertain whether his contract will be extended or if he will be succeeded by his deputy, Datuk Seri Ayob Khan Mydin Pitchay, as reported by Berita Harian (BH) today. As the ...

Semiconductor manufacturing is a highly complex and precise process with numerous steps involved in creating integrated circuits on silicon wafers. Defects can occur at any stage of this process, from ...

College of Material, Chemistry and Chemical Engineering, Key Laboratory of Organosilicon Chemistry and Material Technology, Ministry of Education, Hangzhou Normal University, Hangzhou 311121, China ...