A research team led by physicists Ming Yi and Emilia Morosan from Rice University has developed a new material with unique ...

Specifically designed to enhance the “Reverse Hybrid” assembly process for next-gen electronics, offering superior reliability and higher yield rates. SHENMAO America, Inc. unveils its PF606-P ...

Abstract: Steam-driven delamination failure is a main failure mode in electronics packages during solder reflow. Steam pressures built up within interfaces in packages are sensitive functions of the ...

In a conventional lead-free soldering process reflow ovens operate continuously ... footprint of manufacturing and also enhance the reliability of electronic assemblies by soldering at lower ...

To be fair, the soldering process has been a reliable, even indispensable, workhorse in the electronics industry over those decades. Unfortunately, the forced implementation of lead-free solder ...