This year during APEC, much of the focus revolved around data center power solutions from PSUs and BBUs to IBCs and GPU power delivery.

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB ...

At its CES 2025 presentation, the company only demonstrated the 'high-density' PCB carrying the massive 92 billion-transistor GB202 graphics processing unit, accompanied by 32 GB of GDDR7 memory ...