and high-performance flip-chip ball grid array (FC-BGA) substrates used in artificial intelligence chips. MLCCs for vehicles will soon account for at least a quarter of its entire ceramic capacitor ...

Abstract: Rising power dissipation requirements in modern semiconductor devices have created a need for high performance thermal solutions. These thermal solutions require increasing amounts of ...

086790.KS Hana Financial Group Inc.

Abstract: We discuss the need for noncontact electrical testing of high-performance multi-chip substrates and describe an electron-beam tester developed for this application. We describe the ...