News
Despite falling short of 2025 targets, U.S. CPGs are doubling PCR use and recycling capacity, according to AMERIPEN’s latest ...
10h
Tom's Hardware on MSNIntel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidthIntel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...
6h
The Cool Down on MSNAmazon and Microsoft unveil surprising insights on future plans for their products: 'Our engineers are building tools that didn't exist before'At a recent packaging conference, Amazon's and Microsoft's progress in transitioning to sustainable packaging at scale was ...
Book Abstract: Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the ...
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