In the most advanced automotive applications, where high frequency signals, design density, high pin-count, miniaturization and integration dominate the scene, the use of Ball Grid Array (BGA) package ...

In one BGA package, short failure is been detected by electrical test after JEDEC Bias-HAST condition; after investigation, the BGA organic substrate solder mask to core material adhesion degraded by ...

A comparison of hexagonal boron nitride (hBN) layers grown by chemical vapor deposition on C-plane (0001) versus A-plane (112̅0) sapphire (α-Al2O3) substrate is reported. The high deposition ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

With major manufacturers racing to make smartphones ever thinner, ways to minimize the size of smartphone components have become increasin ...

Asia Pacific advanced IC substrates market will grow by 7.6% annually with a total addressable market cap of $92,888.8 million over 2023-2031, driven by the rising adoption of advanced substrates in ...

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics ...