LG Innotek plans to utilize this investment amount for expanding the FC-BGA mass production line and ... to strengthen the competitiveness of its substrate and optical solution businesses.

According to the semiconductor ... LG Innotek CEO Mun Hyuk-soo launches mass production of FC-BGA substrates for PCs We have started mass production of high-value semiconductor substrates ...

The parts maker is best known for manufacturing camera modules for Apple’s iPhone but began diversifying its portfolio to produce FC-BGA semiconductor substrates in 2022. It also signed a 1.4 ...

Even things like BGA bump layout and via design in the PCB become significant ... This can show up as power supply noise or as noise injected into the substrate of the die. A good PHY design must be ...

As for supercomputing centers and data centers, AI chips often choose BGA, FC-BGA, LGA, PGA ... which gradually evolves from chip to substrate (C2S) and from chip to wafer (C2W), and now it has become ...

A common packaging type, like the Ball Grid Array (BGA), encapsulates the die with molding compound and uses wire bonds to connect the die to a substrate, enabling integration with PCBs. In devices ...

Accordingly, this study aims to investigate the microstructure and mechanical properties of Sn-58Bi solder bearing micro-sized Zn-particles and prepare the ball grid array (BGA) solder joints ... Cu ...