Vapor degreasing is well-suited for modern medical electronics used in implantable devices, diagnostic tools, imaging ...

The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

With major manufacturers racing to make smartphones ever thinner, ways to minimize the size of smartphone components have become increasin ...

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics ...

North America advanced IC substrates market is projected to grow by 6.8% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in ...

Last year, for example, ASE introduced a technology called Fan Out Chip on Substrate (FOCoS). Targeted for the server space, the first customer for FOCoS incorporated separate 16nm and 28nm dies in ...

In one BGA package, short failure is been detected by electrical test after JEDEC Bias-HAST condition; after investigation, the BGA organic substrate solder mask to core material adhesion degraded by ...

In the most advanced automotive applications, where high frequency signals, design density, high pin-count, miniaturization and integration dominate the scene, the use of Ball Grid Array (BGA) package ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...