A common packaging type, like the Ball Grid Array (BGA), encapsulates the die with molding compound and uses wire bonds to connect the die to a substrate, enabling integration with PCBs. In devices ...

You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

Substrates or subfloors are the surfaces on which floorcovering materials are applied. They can be wood, concrete, plywood, stone or metal. Regardless of the material, there are specific ...

Receiving, processing, manufacturing and distributing dairy and other food-related products.

Receiving, processing, manufacturing and distributing dairy and other food-related products.