BGA Flux Pastes: are usually designed based on the requirement for lead-free soldering, so they do not contain lead in their composition and usually have a higher melting point and a longer melting ...

Swapping the chip required learning a new skill: BGA soldering, a non-trivial technique to master. Initially, the soldering didn’t go as planned, requiring extra steps to resolve issues.

The soldering joint might not be captured during a drop test until a functional failure is observed. The BGA can fail due to poor assembly-related issues like the thermal stresses during soldering or ...

No matter whether you use an oven, a hot plate, a hot-air station or any combination of those tools, the basic steps for soldering BGA chips are the same. Let’s start from the bare footprint for ...

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a ...

Also known as Ball Grid Array Soldering, BGA soldering is one major alternative to the field of packaging higher input and output devices as per the modern industrial demands. Unlike any of the other ...