To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

Researchers develop a method to 3D print with coffee grounds and mycelium, resulting in resilient, compostable materials for sustainable packaging solutions.

At Packaging Innovation 2025 held at the Birmingham NEC, UK, Tey Bannerman, partner and head of design, Europe, at McKinsey & Company, spoke of the many ways in which artificial intelligence (AI) is ...

President Joe Biden administration’s had committed to phasing out federal purchases of single-use plastics, including straws, ...