Worldwide sales of semiconductor manufacturing equipment increased 10% to $117.1 billion in 2024 from $106.3 billion in 2023, SEMI, the industry association representing ... The inaugural SEMIEXPO ...

The Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics required to control ... The Center Nanoelectronic Technologies (CNT) ...

STMicroelectronics has introduced a series of serial EEPROMs that contain a unique 128-bit read-only ID (UID) to meet market requirements for product recognition, tracking ... STMicroelectronics has ...

Littelfuse, Inc. highlighted the KSC XA Series Soft Sound Tactile Switches as a key solution for applications requiring quiet, reliable tactile feedback. Designed for surface-mount ... Swiss made die ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Swiss made die bonders from Tresky handle bonding ...

KYZEN will exhibit at the PCIM Expo and Conference, scheduled to take place May 6-8 at NürnbergMesse in Nuremburg, Germany. The KYZEN clean team will showcase ... KYZEN is pleased to announce an ...

To verify the performance of high power network processor chip, 94+ GHz bandwidth elastomer socket can be used with heatsink/axial flow fan to remove 135+ watts of heat ... Ironwood is now producing ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Swiss made die bonders from Tresky handle bonding ...

Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are ...