PMJ 2025 was more than just a successful event—it was a clear signal that the photomask and eBeam communities are growing, ...

Data centers and cloud computing need multi-core and multi-socket scalability. And while the basic building blocks can be ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...

A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was ...

A new technical paper titled “Enabling static random-access memory cell scaling with monolithic 3D integration of 2D ...

Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

A new technical paper titled “Power Consumption Optimization of GPU Server With Offline Reinforcement Learning” was published ...

A technical paper titled “Enhancing Test Efficiency through Automated ATPG-Aware Lightweight Scan Instrumentation” was ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...

Addressing stress-related issues early in the design cycle through a process of chip-package co-design and co-optimization.

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

How much value does DAC really add to the industry? Large EDA companies may be ignoring some of the benefits.