Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

The Chomerics Division of Parker Hannifin Corporation, the global specialist in motion and control technologies, has released ...

This study explores the use of natural phase change materials, including coconut oil and gelatin, to enhance thermal comfort ...

In this paper, a thermal analysis of the IGCT water-cooled heat sink for the SSCB rated for the current of 7.5 kA is described. In order to ensure the reliability of the paralleled connection IGCTs, ...