Henceforth, "building a national technological innovation hub and an original technology cradle for the tin and indium industry, and supporting Yunnan Tin to become a world-class demonstration ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

NASA Dryden has built a new Solder Joint Health Monitoring Testbed ... integrated circuits (ASICs); and exemplary packages are grid arrays such as plastic-type ball grid arrays (PBGAs, PGAs, BGAs), ...

The big news is that the Sony XM6 fold into a ball, much like the Bose QC Ultras (the XM5 didn't). This makes them easier to ...

Two simple USB inventions provide an easy way to test USB cables and chargers, ensuring they are functioning properly. The first invention uses a small plastic ball and a USB female connector to ...

When a contract assembler encountered recurring solder balling on a single capacitor, initial efforts to correct the issue through reflow profile adjustments proved ineffective. This case study ...

Typical Case Study Case 1: BGA edge solder ball not wetting Phenomenon: X-ray inspection found that the BGA corner solder ball void rate> 30%, wetting angle> 110 °. Root cause: the template opening is ...

In that regard, that's where we all want to start -- someone who loves ball and wants to work his butt off ... Matthew Slater ...

Thanks to the the hinges at the end of each sliding arm on the headband, they fold up into a ball to make them easier to carry in ... and the use of gold-infused solder in certain parts of the circuit ...

This makes the Sony WH-1000XM6 a huge deal, not least because the last time we saw a new flagship pair of wireless headphones ...