TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

The use of glass interposers instead of silicon could help Samsung cut production costs while offering more powerful AI chips.

Silicon Labs has announced the first products of its Series 3 portfolio targeting the next generation of IoT devices.

president and CEO of Open-Silicon. Micron Technology, Inc. is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and ...

Researchers developed a faster, more stable way to simulate the swirling electric fields inside industrial plasmas -- the kind used to make microchips and coat materials. The improved method could ...

Silicon Labs launches its first Series 3 wireless SoCs, built on the 22-nm process node, targeting line-powered and ...

SMART Modular Technologies brought something different to the table. While a lot of booths were about RGB and new silicon, ...

SiXG301 and SiXG302, Silicon Labs' first wireless SoC families at 22nm process node, deliver breakthroughs in compute, power ...

Benchmarking shows that an embedded flash memory subsystem relying on R-Stratus-LP consumes ... up to the major actors of the semiconductor industry - with high-density Silicon IP components best at ...

Silicon Labs, the leading innovator in low-power wireless solutions, today announced the first products of its Series 3 ...

Blow up the balloons, bake a cake and spray a bottle of champagne: the humble SD card is celebrating its 25th birthday!

Silicon Labs has just introduced the first 22nm Series 3 SoCs with the SiXG301 and SiXG302 Arm Cortex-M33 multiprotocol wireless SoCs designed for ...