"It affects too many people, and someone could end up dying because someone else decided to take a phone line for a few bucks. And when you put people in danger like that, it's not fair," San Jose ...

Abstract: With SiO 2 dielectric under aluminum pads, a 60 μm bond pad pitch with 52 um bond pad opening Cu wire bonding process was developed in PBGA Hip 7 PGE wafer technology. The critical factors ...