ASE Technology is committing $200 million to test a new method of chip packaging that replaces traditional round wafers with square substrates, which promises to increase the company's advanced ...

Flatten each one with the heel of your hand, dust both sides lightly with flour, and roll the lumps into thin, round wafers about six inches across. (The thickness of a chapati has a lot to do ...

Shin-Etsu is a proven high-quality specialty material producer leveraged to low-cost PVC production. Click here to find out why SHECY stock is a Strong Buy.

Neil Savage describes the uses of the technology and a round-up of products in the area ... both for industrial uses, such as wafer inspection and scribing, and for scientific applications ...