Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory ...

The Cadence HBM4 IP offers a PHY and a high-performance controller as a complete memory subsystem solution and will be ...

SK hynix has showcased its next-gen HBM4 to the public: next-gen AI memory has up to 16-Hi stacks, 2TB/sec memory bandwidth, ...

Isolation: Design and Testbed Evaluation” was published by researchers at Arizona State University and Intel Corporation.

Cadence has announced the first DDR5 12.8-Gbps MRDIMM Gen2 memory IP subsystem fabricated on TSMC’s N3 (3-nm) process.

Crucial's P310 launched late last year as a PCIe 4.0 expansion option for the woefully underwhelming storage capacity found ...

Bit of a cliche, that; still, the T705 is a seriously good example of that very notion, us meagre humans pushing hardware to ...

The new Cadence HBM4 IP offers a PHY and a high-performance controller as a complete memory subsystem solution. The HBM4 PHY will be available as a drop-in hardened macro in the TSMC N3 and N2 ...

Semiconductor design firm Montage Technology is currently one of the world’s three main suppliers of connector chips to the ...

SK Hynix Inc., the leading global high-bandwidth memory (HBM) chip provider, has moved faster than its rivals in the ...