Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

The novel integration of patterned flexible film and a 3D printing post endows the device with force-sensing capabilities. The proposed sensor adopting a compact and elegant design enables operation ...

Advanced packaging allows multiple devices to be merged and packaged as a single electronic device. Packaging technology can enhance semiconductor performance without having to shrink the nanometer ...

Abstract: This paper gives a detailed analysis on the assembly and packaging technologies for the state-of-the-art GaN-based high-electron-mobility transistors, which are suitable for high-temperature ...