“Starting with traditional solder bump flip chip interconnect, the pitch capability is determined by collapse height for underfill, capture pad pitch for trace routing, capture pad pitch for ...

DeepMaterial is also the only one to have developed an underfill that does not flow fluxing that greatly simplifies conventional flip chip assemblies, a few of which are fully cured during normal ...

E&R will highlight its latest solutions in Advanced Packaging, including high-precision laser drilling for 2.5D/3D ICs, ...

Its Flip Chip BGA solutions include pre-flip chip die bond plasma cleaning, pre-molding/underfill plasma cleaning, and on boat/tray laser marking for traceability, ensuring high-quality, reliable ...