Flip Chip Ball Grid Array (FCBGA) technology has become a cornerstone of modern semiconductor packaging, offering superior electrical and thermal performance. As electronic devices demand higher power ...

To evaluate the impact of this high pressurization on the TIM I and package warpage, a simulation study was conducted. High deformation of a VC heat spreader on an FCBGA package could degrade the ...

A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.