LG Innotek will invest 600 billion won ($408 million) into its factory in Gumi, North Gyeongsang, through December 2026.

Flip chip substrates use electroless plating methods such as Organic Solderability Protectant (OSP) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG). For Wirebond BGA substrates, ...

With the investment made at that time, LG Innotek acquired the Gumi Plant 4, which has a total floor area of 230,000 square ...

has started the mass production of flip-chip ball-grid array (FC-BGA) substrates, the high-end chip substrates for servers and data centres, a highly lucrative but competitive field driven by ...