FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform ...

producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These substrates are essential for connecting electronic components to semiconductors, enabling the flow of ...

In 2022, LG Innotek announced its plans to launch a business producing FC-BGAs, high-value semiconductor substrates ... has established a cutting-edge FC-BGA production infrastructure that ...

FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform various ...

Internalization of glass core technology, step-by-step entry into high-end FC-BGA market Over the past 50 years, LG Innotek has accumulated core technologies for high-value semiconductor substrates, ...