The next-gen substrate allows for denser circuitry for smaller, higher-performance semiconductor substrates, and improved ...

With major manufacturers racing to make smartphones ever thinner, ways to minimize the size of smartphone components have become increasin ...

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics ...

FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform various ...

In 2022, LG Innotek announced its plans to launch a business producing FC-BGAs, high-value semiconductor substrates. To build the Dream Factory, the company acquired LG Electronics' Gumi 4 Factory ...

The Dream Factory, spanning a total area of 26,000 square meters, is regarded as the industry's most advanced "smart" factory, integrating the latest IT technologies, including artificial intelligence ...

In 2022, LG Innotek announced its plans to launch a business producing FC-BGAs, high-value semiconductor substrates. To build the Dream Factory, the company acquired LG Electronics' Gumi 4 Factory and ...

Minseok Kang, vice president and head of LG Innotek's Substrate & Material Business Unit, said, "LG Innotek will continue to expand the production of FC-BGAs that provide exceptional customer value ...

Located about 260 kilometers southeast of Seoul, the facility serves as LG Innotek’s flagship production hub for flip-chip ball grid array, or FC-BGA, a high-value semiconductor package substrate.