LG Innotek is planning to grow its semiconductor components business to 3 billion dollars in annual sales by 2030, largely based on high-value semiconductor substrates such as FC-BGA(Flip-Chip ...

LG Innotek is planning to grow its semiconductor components business to 3 billion dollars in annual sales by 2030, largely based on high-value semiconductor substrates such as FC-BGA(Flip-Chip Ball ...

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Even things like BGA bump layout and via design in the PCB become significant ... This can show up as power supply noise or as noise injected into the substrate of the die. A good PHY design must be ...

Carry out multi-layer BGA substrate designs (wire-bond, Flip-chip or System-in-Package) meeting signal- and power integrity requirements on package level within Infineons product development projects ...

or BGA and is a reworkable underfill. This glue can form a consistent and defect-free underfill layer, effectively reducing the impact caused by the thermal expansion coefficient mismatch between the ...