LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates.

In the FC-BGA substrate business, Toppan is working on the development of substrates corresponding to photonics-electronics convergence technology represented by NTT’s Innovative Optical and ...

FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform various ...

Trends, opportunities, and forecast for the global IC substrate in the global PCB market from 2017 to 2028 by type (FC BGA and FC CSP), application (tablet PC, smartphones, laptops, wearable ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this year CEO Jeong Cheol-dong ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this year CEO Jeong Cheol-dong ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this yearCEO Jeong Cheol-dong "Enabling ...