What does all this mean? Subtractive patterning is most used for wirebond BGA substrates where line/space requirements are >35/35 um. The starting point is a copper clad laminate (CCL) core. It ...
Korea JoongAng Daily on MSN2d
LG Innotek to invest $408 million to upgrade chip factoryLG Innotek will invest 600 billion won ($408 million) into its factory in Gumi, North Gyeongsang, through December 2026.
With the investment made at that time, LG Innotek acquired the Gumi Plant 4, which has a total floor area of 230,000 square ...
The company started production of FC-BGA substrates in December at its flagship plant in Gumi, North Gyeongsang Province, the same plant where it produces camera modules for Apple’s iPhones.
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