You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

Altera highlights its latest FPGA innovations at Embedded World 2025, including the Agilex 3 and Agilex 5 E-Series FPGAs.

AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, is pleased to announce a strategic partnership with ...

Synaptics announced an AI MCU at Embedded World today, based around Arm's Ethos-U55 NPU (neural processing unit) and ...

He added, "The increase in sales of the next-generation growth product FC BGA (flip chip ball grid array) and the high likelihood of supplying high-value products to Intel have increased," noting ...

FPGA chip company Altera has unveiled its latest hardware offering, Agilex 3, specifically designed for low-power ...

LG Innotek is planning to grow its semiconductor components business to 3 billion dollars in annual sales by 2030, largely based on high-value semiconductor substrates such as FC-BGA(Flip-Chip Ball ...

Altera’s Agilex 3 FPGA, built for power-constrained applications, almost doubles the performance of the Cyclone V.

ALTERA Agilex FPGAs, Quartus Prime Pro software and FPGA AI Suite enable the rapid development of highly customized embedded ...

Altera Corporation unveiled its latest programmable solutions tailored for embedded developers who are pushing the boundaries ...

G networking links and interfaces are in the commercialization stage, and 224G implementations for the data center are not ...