EnSilica, a maker of mixed signal ASICs, has announced that it has established a new engineering hub in Cambridge, UK.

Rhopoint Components is now stocking the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module.

Research suggests that the rapid growth in XR content consumption is set to put a major strain on existing networks.

NXP Semiconductors announces the NTAG X DNA, a new Type 4 secure connected NFC tag, enabling secure authentication.

TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

SCI Semiconductor raises £2.5m towards developing its security-enhanced MCU based on CHERI, a memory securing framework.

TI's technologies will help enable NVIDIA’s 800V DC power-distribution systems for next-generation AI data centres.

Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to TSMC and Samsung, plans to cut PIMEL shipments.

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer, at ...

Eaton, the intelligent power management company, has announced the launch of the 9PX Gen2 5-11kW UPS - a new product that ...