The Biden administration launched a probe into Chinese-made legacy semiconductors, citing national security risks and unfair subsidies. The investigation may lead to tariffs or import restrictions, ...

Here we cover various packaging technologies and methods, including how solder products are integrated into these processes, while shedding light on the evolving convergence between ASP and SMT.

TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. With fresh investments from OSAT ...

Google's quantum chip, Willow, delivers groundbreaking speed, solving tasks in minutes that would take supercomputers septillions of years. Despite cryptographic concerns, it paves the way for quantum ...

Intel's Sanjay Natarajan highlights Moore's Law's economic foundation & global influence. As physical limits loom, cutting-edge technologies like advanced packaging & Selective Layer Transfer push ...

Samsung Electronics and Texas Instruments finalized agreements for billions in US government funding under the CHIPS Act, boosting domestic semiconductor production. Samsung will receive $4.75 billion ...

Synopsys' AI strategy lead Stelios Diamantidis predicts AI agents will collaborate by 2025, driving the next phase of AI deployment. These agents, evolving from simple bots to sophisticated systems, ...

The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks. The investigation may lead to ...

Google's quantum chip, Willow, sets a new benchmark with its speed and enhanced error correction. Experts highlight its potential to disrupt cryptocurrency security ...

SK hynix launched its HBM3E chip, pioneering a 6-phase RDQS scheme. This innovation enhances AI efficiency and reliability while addressing semiconductor scaling and data transmission challenges ...

The Biden administration plans to blacklist Sophgo, a Chinese company tied to Huawei's AI-chip supply chain, after discovering its TSMC-made chip was used in Huawei's Ascend 910B processor. Sophgo ...

WeEn Semiconductor introduces top-side-cooling SiC devices in TSPAK and TOLT packages, reducing thermal resistance by 17%-19%. These innovative components boost ...