Fig.1 Solder balling/beading Solder beading Solder beading is big solder ball, it occurs when isolated solder paste aggregates are formed under low stand-off components. At reflow, the aggregate ...

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...

Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...