With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...

The RAM chip is held in place using a BGA (Ball Grid Array) and so the heat needs to loosen every solder ball before the chip will yield. Just as before, MadEDoctor cleans up the pads with a ...

Under the lens, a BGA solder ball used for chip packaging, when magnified tens of thousands of times, reveals a magnificent sight resembling cosmic planets. Researchers from the Yunnan Tin and Indium ...