FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform ...

producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These substrates are essential for connecting electronic components to semiconductors, enabling the flow of ...

The parts maker is best known for manufacturing camera modules for Apple’s iPhone but began diversifying its portfolio to produce FC-BGA semiconductor substrates in 2022. It also signed a 1.4 ...

In 2022, LG Innotek announced its plans to launch a business producing FC-BGAs, high-value semiconductor substrates ... has established a cutting-edge FC-BGA production infrastructure that ...

FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform various ...

Internalization of glass core technology, step-by-step entry into high-end FC-BGA market Over the past 50 years, LG Innotek has accumulated core technologies for high-value semiconductor substrates, ...