In the FC-BGA substrate business, Toppan is working on the development of substrates corresponding to photonics-electronics convergence technology represented by NTT’s Innovative Optical and ...

The U.S. Advanced IC Substrate Market was valued at USD 2.92 billion in 2024 and is projected to reach USD 9.07 billion by 2032, expanding at a CAGR of 15.29% during the forecast period from 2025 to ...

FC-BGA (Flip Chip Ball Grid Array): This is a semiconductor substrate that is widely applied to electronic devices equipped with semiconductor chips (CPU, GPU, AI chips, etc.) that perform various ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this yearCEO Jeong Cheol-dong "Enabling ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

Hsinchu, Taiwan-based semiconductor testing and assembly services provider ChipMOS Technologies Inc. has signed a one-year ball grid array (BGA) substrate supply agreement with Ryowa Co. Ltd., under ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this yearCEO Jeong Cheol-dong ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this yearCEO Jeong Cheol-dong ...

New FC-BGA Substrate unveiled in the CES 2023 1st Significant production achieved in last year, Full-Scale Production will be possible in the 2nd half of this this yearCEO Jeong Cheol-dong ...