However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

Once he has the solder paste on, he places the components ... [Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard to ...

1) BGA sockets can't be re-soldered by hand. They're very fine and go underneath the chip in a way that's inaccessible. They're typically applied by oven and people who try to reflow the solder at ...

The soldering joint might not be captured during a drop test until a functional failure is observed. The BGA can fail due to poor assembly-related issues like the thermal stresses during soldering or ...

A BGA is a complex semiconductor package consisting of multiple elements, including: One or more silicon dies A silica-filled epoxy encapsulant A layered composite of copper and glass fiber-reinforced ...

Claiming to be ideal for BGA rework and repair, these electrically-conductive, solder-free adhesives are supplied as a dry film on a Mylar carrier and are Z-axis conductive. The adhesives are ...

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...