However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

Once he has the solder paste on, he places the components ... [Colin] uses a microscope to do some inspection of the board, although the BGA could have concealed faults that would be hard to ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

BEST Inc. is an ISO 9001:2015 and ITAR certified provider of BGA reballing, PCB and component rework services, focusing on quality, reliability, and sustainability. With a commitment to innovation, ...