Ray Wang of Futurum says SK Hynix will be able to hold on to its lead in high bandwidth memory chip technology despite ...

Enfabrica Corp.’s hybrid memory fabric system designed to improve efficiencies in large-scale distributed, memory-bound AI inference workloads is now available.

High-Bandwidth Memory Chips Market is Segmented by Type (HBM2, HBM2E, HBM3, HBM3E, Others), by Application (Servers, Networking Products, Consumer Products, Others): Global Opportunity Analysis and ...

Enfabrica Corporation, an industry leader in high-performance networking silicon for artificial intelligence (AI) and ...

Enfabrica, a Silicon Valley-based chip startup working on solving bottlenecks in artificial intelligence data centers, on ...

The SEMI Silicon Manufacturers Group (SMG) has reported, in its quarterly analysis of the silicon wafer industry, that ...

Revenue rose about 35% in the June quarter compared with the same period a year earlier, while operating profit jumped nearly ...

ENFABRICA Elastic Memory Fabric System (EMFASYS) hardware and software solution improves the compute efficiencies in ...

Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, ...

Generative AI is arguably the most complex application that humankind has ever created, and the math behind it is incredibly ...

High-bandwidth memory, or HBM, is poised for a breakthrough year in 2026 as AI’s compute-hungry needs continues to reshape the memory landscape, UBS analysts said in a recent note.

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface.